Releases: renesas/fsp
v2.2.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.2.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v2_2_0_e2s_v2020-10.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v2_2_0_rasc_v2020-11.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2019-q4-major
QE for Capacitive Touch : 1.2.0
Features Added
- RA2L1 MCU support added.
- EK-RA2L1 Board support added.
- RSSK-RA2L1 Board support added.
- RA2L1 MCUs can choose LDO or DCDC voltage regulator through new R_BSP_PowerModeSet() function.
- RA4M3 MCU support added.
- EK-RA4M3 Board support added.
- Implemented Arm TrustZone stack sealing. More info here.
- Hardware crypto acceleration support for AES192 (ECB, CBC, CTR, GCM chaining modes); ECC256 and ECC384 Brainpool curves are now available on RA6M4 and RA4M3.
- USB host and peripheral vendor class support added.
- LittleFS now has thread safe option.
- RM_FREERTOS_PLUS_FAT_MediaInit() now accepts rm_freertos_plus_fat_device_t structure in rm_freertos_plus_fat_disk_cfg_t to provide sector information. Duplicate structure data members have been deprecated.
Third Party Software
These third party software solutions are included alongside FSP.
Arm Mbed Crypto: 3.1.0+renesas.2
Arm Trusted Firmware-M: 1.1.0+renesas.1
Bug Fixes
Arm has disclosed a potential Armv8-M processor Secure software Stack Sealing vulnerability on 16th October 2020. This issue can be tracked here.
See fixed GitHub Issues for this release.
This release also includes bug fixes from releases v2.0.2 and v2.1.1.
See fixed GitHub Issues for v2.0.2.
See fixed GitHub Issues for v2.1.1.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.2.0.zip a8f963d8db89e0459032a7a4ce0a6411
- FSP_Packs_v2.2.0.exe 0bc857d2fbf24dff3a1d93840f94d03a
- fsp_documentation_v2.2.0.zip f90fe5d14700d7dbfa5a2ae8aa330b67
- setup_fsp_v2_2_0_e2s_v2020-10.exe ed2c95650d7b1d8d042d5b9158dff140
- setup_fsp_v2_2_0_rasc_v2020-11.exe 0315aad97e6e4b1e8dd15247a4f8d125
- MDK_Device_Packs_v2.2.0.zip 9335b9146b0f025d315d78c8b9001594
v2.0.2
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.0.2.
This release includes packs that are installed separately from e2 studio. This means the v2.0.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.0.2.zip 66d8e6fd51aae9b32ec57467b2087ae6
- FSP_Packs_v2.0.2.exe 590c3773e0c2de2417f0d9c2da7be949
- fsp_documentation_v2.0.2.zip bc9cba5176f316d56c05868858e3dc40
v2.0.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.0.1.
This release includes packs that are installed separately from e2 studio. This means the v2.0.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
- The TF-M module used a hardcoded value as its seed. BL2 now generates a new seed on each reboot and saves it to the shared secure RAM. TF-M was updated to use the shared seed from BL2.
- The TF-M module used a hardcoded array as its device unique key, It has been updated to use the device unique ID instead. Key derivation is performed using the unique ID and user provided label.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.0.1.zip c7dc7cd51ec1d0289296cafc2886b0c7
- FSP_Packs_v2.0.1.exe a32ac67ff203b603ef7454852240e6e8
- fsp_documentation_v2.0.1.zip 3111744f2c26abe5dc94fe11bbcf7134
v2.1.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.1.1.
This release includes packs that are installed separately from e2 studio. This means the v2.1.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
- MbedTLS uses HW crypto acceleration on the RA6M4. ECC Wrapped key support has been added to the TLS handshake sequence on RA6M4.
- When building TrustZone secure projects with the IAR compiler using -Ol (Low) optimization, there was a linker error from bsp_security.c.
- In RA6M4 flat projects, OFS1_SEL selected the non-secure OFS1 register for HOCO settings, but the non-secure OFS1 register was not initialized.
- The AGT driver would write outside the bounds of an array on RA6M4 when using channels 2-5.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.1.1.zip ba33826850860350d502ad6164f47ad8
- FSP_Packs_v2.1.1.exe 948131f3993dd239dad343ab2cc5f8a4
- fsp_documentation_v2.1.1.zip 57185b6912ba5bde46049f7a84cfb2a2
v2.1.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.1.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v2_1_0_e2s_v2020-10.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v2_1_0_rasc_v2020-11.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2019-q4-major
QE for Capacitive Touch : 1.2.0
Features Added
- RA6T1 MCU support added.
- RSSK-RA6T1 Board support added.
- Motor control middleware added:
- rm_motor_current
- rm_motor_driver
- rm_motor_estimate
- rm_motor_sensorless
- rm_motor_speed
- Added support for using AWS HTTPS Client in FSP projects.
- USB composite support added:
- PMSC + PCDC
- PCDC + PHID
- PMSC + PHID
- PCDC + PCDC
- New BSP API has been added to change OctaSPI Clock at run time. Added fix to clear dummy cycle register when switching from OPI to SPI mode.
- More hardware acceleration added to mbed-crypto:
- Added support for AES GCM for 128 and 256 bit keys
- Added ECDH support
- Renesas Advanced Smart Configurator (RASC) added tooling support for RA6M4 Arm® TrustZone® for Keil MDK tool and IAR Embedded Workbench.
Third Party Software
These third party software solutions are included alongside FSP.
Arm Mbed Crypto: 3.1.0+renesas.2
Arm Trusted Firmware-M: 1.1.0+renesas.1
Bug Fixes
- R_BLE_L2CAP_RegisterCfPsm() API would get stuck in an infinite loop when registering L2CAP callback function.
- Disable the use of WiFi API functions WIFI_Scan(), WIFI_Ping(), SOCKETS_GetHostByName(), WIFI_GetMAC(), and WIFI_GetIP() during an active socket connection when using one UART. All open sockets must be closed before these functions are called.
- Fixed an issue causing LittleFS configuration properties to be applied incorrectly.
- Exporting a wrapped persistent AES256 key and then re-importing it after destroying the key handle for AES GCM usage did not work.
- Updated WiFi scan results parser to handle large number of access points without the WIFI_Scan() call returning a failure.
- Added option in Virtual EEPROM to configure the physical start address. Projects currently using a non-default start address will need to update the RA Configuration editor for the rm_vee_flash module, and re-generate their project content.
- SSI would generate two TX_EMPTY callbacks per write. Now it generates only one.
Known Issues
- Issue
Due to the changes in Linker SCAT file format in FSP 2.x, please ensure that a Keil MDK pack version 2.x is used with FSP 2.x. Failure to do so will cause linker errors. For existing projects based on FSP 1.x please continue to use Keil MDK pack 1.x - Issue
Renesas Advanced Smart Configurator (RASC) for IAR EWARM and Keil MDK work flow has been changed in the 2020-11 version onwards. Refer to the RASC quick start guide attached to this release for the details. - Issue
When debugging a Non Secure project in IAR EWARM, it is necessary to force a hardware reset to pick up the correct reset vector. This can be done by adding the following to the Options | Debugger | Extra Options dialog in EWARM: --drv_vector_table_base=0x0 - Issue
When debugging a "flat" (non-TrustZone) project in IAR EWARM with a device that supports TrustZone, the device partition sizes are always reported as needing to be updated. This can be worked around by unchecking the "Use macro file(s)" check box in the Options | Debugger | Setup dialog in EWARM and setting device partition sizes manually (if required) with the Renesas Device Partition Manager. - Issue
When building TrustZone secure projects with the IAR compiler using -O1 (Low) optimization, there is a linker error from bsp_security.c.
Workaround
Build with -Oh (High, Balanced) optimization. Select the project or the file bsp_security.c and select "High" and "Balanced" from Options | C/C++ Compiler | Optimizations. Check "Override inherited settings" to change the setting for bsp_security.c only. - Issue
mbedTLS can run on RA6M4 using software crypto only. - Issue
USB_VBUS pin (P4_07) is not available to configure through the pin configurator for the RA4W1.
Workaround
Use the R_IOPORT_PinCfg() function to configure the USB_VBUS pin (P4_07). - Issue
Mbed Crypto is currently not thread safe when being used standalone (ie: as top of stack) in a FreeRTOS project.
Workaround
The user should add a mutex around calls to Mbed Crypto. - Issue
In some cases GCC is removing debug information for functions in a Secure project. This is being actively investigated. - Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviation. - Issue
USB driver jumps to the default hander when closing either USB IP0 or USB IP1 module by calling R_USB_Close function while HMSC and PCDC are working. - Issue
The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Workaround
Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value. - Issue
In the write completion event of PCDC + PCDC composite class, "USB_CLASS_PCDC2" is not set to the member "type" of "usb_event_info" structure.
Workaround
Please use the member "pipe" in "usb_event_info" structure to determine the PCDC channel number after the write event is completed in PCDC + PCDC. - Issue
An error is output when selecting DMA feature in RA configuration of USB composite class. Please ignore this error. - Issue
Dividers >= 20 for Bus Timing > QSPKCLK Divisor are off by 1.
Workaround
When selecting a divider >= 20 for Bus Timing > QSPKCLK Divisor, select the next available smaller divider. Do not select the maximum divider of 48.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.1.0.zip dd2f3366bff68fcbad0c2add3a6bf035
- FSP_Packs_v2.1.0.exe b40ff9df82a35ba77b087afc85df04bf
- fsp_documentation_v2.1.0.zip dd0e13ea93a84249e63e5ec8dc326398
- setup_fsp_v2_1_0_e2s_v2020-10.exe 4f3c83f3ab5b767e7aa805b11225a075
- setup_fsp_v2_1_0_rasc_v2020-11.exe 2f987d6a46269e9c7306358ee30dd41d
- MDK_Device_Packs_v2.1.0.zip 88e3d2a6393777d0302f8219f3995375
- rasc_quick_start_fsp_v2_1_0_rasc_v2020-11.zip d2118374b488025d8c48b89fb71dd963
v2.0.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.0.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v2_0_0_e2s_v2020-10.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v2_0_0_rasc_v2020-10.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2019-q4-major
QE for Capacitive Touch : 1.2.0
Features Added
- RA6M4 MCU with Arm® TrustZone® support. Users can now create Secure, Non-Secure, and Flat projects.
- EK-RA6M4 board support.
- Many FSP modules now have Guard functions to aid with Arm® TrustZone® development. Refer to the Configuration section in the FSP user manual for each module to see if the module supports Guard functions.
- Added hardware crypto support to access enhanced Secure Crypto Engine (SCE) peripheral on RA6M4 MCU.
- New Renesas pin configurator for RA6M4.
- Updated FreeRTOS port to support calling into Secure area from Non-secure task.
- OSPI driver, r_ospi, is now available.
- PLL2 support added to r_cgc.
- Updated Amazon FreeRTOS to version 202007.00.
- Added the ability to remove Secure Sockets TLS Support stack element from a Secure Sockets on WiFi element in an e2 studio project. With TLS removed the memory requirements for an e2 studio WiFi project is greatly reduced.
- Touch pad support added to rm_touch module.
- FreeRTOS+TCP macro ipconfigIGNORE_UNKNOWN_PACKETS is now configurable in the RA configurator.
- The correction calculation accuracy of CTSU1 is improved to reduce the variation of measured values for each chip.
- BLE on RA4W1 can now be used in a multithreaded environment.
Third Party Software
These third party software solutions are included alongside FSP.
Arm Mbed Crypto: 3.1.0+renesas.2
Arm Trusted Firmware-M: 1.1.0+renesas.1
Bug Fixes
- Added a property to r_ether_phy module in e2 studio for configuring mii_type.
- Fixed USB HHID and HCDC issues where bare metal version would not work in FSP v1.3.0.
- Fixed fault that would occur during enumeration of PHID in FSP v1.3.0.
- Fixed fault that would occur when calling R_USB_EventGet() in bare metal projects for FSP v1.3.0.
- In the FreeRTOS General properties, the default value of Assert has been changed to "if (!(x)) { __BKPT(0); }". This new implementation reduces code size because it does not store strings for the file, line, and function in the binary.
- MBEDTLS_PLATFORM_MEMORY, MBEDTLS_THREADING_ALT and MBEDTLS_THREADING_C are now enabled by default.
- Projects built with the Arm Compiler 6 toolchain reserved extra flash memory for uninitialized RAM sections such as .fsp_dtc_vector_table, .stack, and .noinit. These sections have been renamed to start with ".bss." to fix this.
- Removed board configuration macros from "board.h". The correct default macros are generated by the configurator for each board.
- Resolved issue with JPEG when used in emWin with parameter checking enabled and the "Input Alignment" option set to "Unaligned (slower)"; existing projects may need to ensure EMWIN_JPEG_NUMBYTES_INBUFFER is set to 0xFFFFFFF8.
- When a duty cycle of (period - 1) was requested for the GPT in PWM mode (saw wave), it would output a 100% duty cycle.
- USB PMSC driver now properly handles locked SD cards.
- Removed duplicate SSI TX_EMPTY callback.
Known Issues
- Issue
Renesas Advanced Smart Configurator (RASC) for IAR EWARM and Keil MDK tools does not support the RA6M4 Arm® TrustZone® feature in this version. This is expected in the next release. - Issue
Exporting a wrapped persistent AES256 key and then re-importing it after destroying the key handle for AES GCM usage will not work. - Issue
Due to the changes in Linker SCAT file format in FSP 2.x, please ensure that a Keil MDK pack version 2.x is used with FSP 2.x. Failure to do so will cause linker errors. For existing projects based on FSP 1.x please continue to use Keil MDK pack 1.x - Issue
USB_VBUS pin (P4_07) is not available to configure through the pin configurator for the RA4W1.
Workaround
Use the R_IOPORT_PinCfg() function to configure the USB_VBUS pin (P4_07). - Issue
When a large number of WiFi access points are available for scan the WIFI_Scan() function can fail due to the RX CMD Port buffer size being insufficient.
Workaround
To avoid WiFi scan failures in an environment with many access points the user must increase the size of the RX CMD Port buffer in the configurator. - Issue
Mbed Crypto is currently not thread safe when being used standalone (ie: as top of stack) in a FreeRTOS project.
Workaround
The user should add a mutex around calls to Mbed Crypto. - Issue
In some cases GCC is removing debug information for functions in a Secure project. This is being actively investigated. - Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviation. - Issue
R_BLE_L2CAP_RegisterCfPsm() API gets stuck in an infinite loop when registering L2CAP callback function. - Issue
If parameter checking is enabled, R_CGC_ClocksCfg() returns an error when a project is migrated from 1.x to 2.x.
Workaround
The new field cgc_clocks_cfg_t::pll2_state must be initialized to CGC_CLOCK_CHANGE_NONE to avoid a parameter checking error.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v2.0.0.zip 16952bce908c83bd47b490adcab11229
- FSP_Packs_v2.0.0.exe 43dec9cb5105c1d5fa367eae42076096
- fsp_documentation_v2.0.0.zip 98cdb2564b634e7c5ce3d13d470f3b9a
- setup_fsp_v2_0_0_e2s_v2020-10.exe 39bbfa68b369144897313c3aa010e929
- setup_fsp_v2_0_0_rasc_v2020-10.exe 5f02a5cf138f8cff9ec64eb608670c7e
- MDK_Device_Packs_v2.0.0.zip fb9b9d65e245926932eeb91531e0637c
v1.3.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.3.1.
This release includes packs that are installed separately from e2 studio. This means the v1.3.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
- Fixed fault that would occur when calling R_USB_EventGet() in bare metal projects for FSP v1.3.0.
- Fixed fault that would occur during enumeration of PHID in FSP v1.3.0.
- Fixed RAM corruption issue in R_USB_Open() in USB Host driver.
MD5 Checksums
- FSP_Packs_v1.3.1.zip ba698b55388b8bddd638d9860b970187
- FSP_Packs_v1.3.1.exe 52f1465d2cdfa8face05a99662ca409d
- fsp_documentation_v1.3.1.zip 4078934efd3a3f7b92ab9a890b75d92b
v1.3.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.3.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v1_3_0_e2s_v2020-07.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_3_0_rasc_v2020-07.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2019-q4-major
QE for Capacitive Touch : 1.1.0
QE for BLE : 1.0.0 *Refer to Known Issues section if using this tool
e2 studio: v2020-07
Features Added
- Virtal EEPROM module added
- R_ADC_InfoGet() now supports reading TSN calibration data for RA6 devices
- USB HMSC and PCDC can now be used at the same time on different USB ports on the RA6M3
Third Party Software
These third party software solutions are included alongside FSP.
Arm Mbed Crypto: 3.1.0+renesas.1
Bug Fixes
- Removed board configuration macros from "board.h". The correct default macros are generated by the configurator for each board.
- AC6 linker scripts now have RAM end address and will report an error when RAM is overflowed.
- Fixed incorrect values (larger by 1) getting set in bit_timing_cfg for r_can in e2 studio. These include time segments 1 and 2 and synchronization jump width.
- Fixed build warnings in generated code for GPT, ADC, and OPAMP.
- When long file name (LFN) and Unicode UTF16 Support in FreeRTOS + FAT configuration is enabled a build error was thrown by the compiler.
- Fixed a memory leak issue in BLE library when closing module.
- The semaphore timeout for the Silex WiFi module is now properly exported from the e2 studio configurator.
- When SPI slave mode is used it was possible to choose a slave select other than SS0 in RA configurator. The only valid option is SS0 and that is now checked.
- Building a project in IAR Embedded Workbench with RASC would fail due to duplicate definition error for R_BSP_WarmStart().
- The minimum allowed FCLK frequency for Flash LP use was hard coded as 4MHz when some parts supported 1MHz.
- Fixed an issue with unexpected interrupts on multi-master IIC buses.
- ADC16 internal reference on RA2A1 was not disabled by calling R_ADC_Close().
- GLCDC pins are no longer configured by default on the EK-RA6M3.
- Fixed a typo in a GPT GTETRGD configuration option.
- The generated code for r_ether did not have externs for the configuration and control structures.
- The Flash HP module in the RA Configurator did not check for the callback being NULL when BGO was enabled.
- CRC seed value was not set correctly for 8 or 16 bit values.
- In FreeRTOS *FromISR() APIs, interrupt priority levels (IPLs) were not checked for interrupt numbers less than 16, and validation always failed for interrupt numbers greater than 16. Now all IPLs are checked to ensure they cannot interrupt the scheduler.
- BSP clock frequency macros for MOCO, LOCO and SUBCLOCK are now exposed.
- Fixed a parameter checking issue in FLASH_HP when erasing a portion of the first 8 blocks of code flash.
- RA4W1 projects with Custom User Board chosen could not be created in e2 studio.
Known Issues
- Issue
The QE for BLE tool v1.0.0 does not support e2 studio version 2020-04 or newer. The platform installer for this release will install e2 studio 2020-07.
Workaround
Applications that need to use the QE for BLE tool must use e2 studio v7.8 which can be downloaded from a previous FSP release. This release can be installed into e2 studio v7.8 using the packs, or standalone pack installer, that can be found in the Assets section of this release. - Issue
USB PMSC Driver does not return an error when the user tries to write data to a locked SD Card. - Issue
The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Workaround
Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value. - Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviation. - Issue
Exporting a wrapped persistent AES256 key and then re-importing it after destroying the key handle for AES GCM usage will not work.
MD5 Checksums
- FSP_Packs_v1.3.0.zip cf64ac2c5e638ac29f447bba6970b5a5
- FSP_Packs_v1.3.0.exe e2951772464523db4a8138957a1d825b
- fsp_documentation_v1.3.0.zip 38c278e1531a59e4c61ca24037a29697
- setup_fsp_v1_3_0_e2s_v2020-07.exe cf76fdd55de9c80ffa109a9d2c32b12f
- setup_fsp_v1_3_0_rasc_v2020-07.exe 9be1701cbcd925d4953dad98a160aa8f
- MDK_Device_Packs_v1.3.0.zip e4eb4cf786c3e4c563a6f3e2d062f68c
v1.2.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.2.0.
Download the FSP with e2 studio Installer for this release, setup_fsp_v1_2_0_e2s_v2020-04.exe, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_2_0_rasc_v2020-04.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
GCC Compiler : 9-2019-q4-major
QE for Capacitive Touch : 1.1.0
QE for BLE : 1.0.0 *Refer to Known Issues section if using this tool
Features Added
- PDC driver (r_pdc) now available
- SEGGER emWin updated to v6.14a
- Arm Compiler used for development and testing updated to v6.14
- Arm CMSIS updated to v5.7.0
- The PSA Crypto ECDH implementation on RA6 devices was updated to utilize hardware acceleration resulting in significantly better performance
Third Party Software
These third party software solutions are included alongside FSP.
Arm Mbed Crypto: 3.1.0+renesas.1
Bug Fixes
- Fixes register settings that now allow user to provide external high-potential reference voltage (VREFH0) for ADC16 on the RA2A1.
- Removed the "Name" property for rm_wifi_onchip_silex in the configurator since the instance is global.
- Fixed issue in DAC8 module where channel 1 was clearing the incorrect bit in MSTPCRD.
- Parameter checking can now be enabled in RM_LITTLEFS_FLASH.
- Fixed mask/check for available OPAMP channel on RA4W1.
- Resolves CAN baud rate specific enum IAR warnings and fixes the range parameter check for prescalar value
- Calling R_ADC_InfoGet() on a RA6M1 device would incorrectly read data from a MCU address that could cause Flash API issues if a flash operation was on-going.
- USB suspend operation in host mode was not supported.
- emWin JPEG input streaming issue fixed for 8-byte aligned mode.
- SweynTooth vulnerability fix added to BLE library.
- USB HMSC updated to improve performance.
Known Issues
- Issue
The QE for BLE tool v1.0.0 does not support e2 studio version 2020-04 or newer. The platform installer for this release will install e2 studio 2020-04.
Workaround
Applications that need to use the QE for BLE tool must use e2 studio v7.8 which can be downloaded from a previous FSP release. FSP v1.2.0 can be installed into e2 studio v7.8 using the packs, or standalone pack installer, that can be found in the Assets section of this release. - Issue
When long file name (LFN) and Unicode UTF16 Support in FreeRTOS + FAT configuration is enabled, build error is thrown by the compiler. - Issue
USB PMSC Driver does not return an error when the user tries to write data to a locked SD Card. - Issue
The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
Workaround
Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value. - Issue
When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
Workaround
Do not use duplicate UUIDs or abbreviation.
Breaking Changes
- Issue
The aws_clientcredential.h file is now generated by default. This can lead to multiple instances of the file if migrating from a previous FSP version where the file was created manually. Include path ordering will dictate which file gets chosen.
Workaround
The new AWS Client Credentials module has an option in its Properties to include a header file. Rename the existing aws_clientcredential.h header file in the project and then add its new name to the Properties for AWS Client Credentials.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v1.2.0.zip 94e64c02a666499976b14a0e47d220e4
- FSP_Packs_v1.2.0.exe 371ca13f358092b650c8b968dfdab246
- fsp_documentation_v1.2.0.zip 23ea1a7afc57ed00973c1949163b1280
- setup_fsp_v1_2_0_e2s_v2020-04.exe 05c0b922346979874d57497d2cfe3576
- setup_fsp_v1_2_0_rasc_v2020-04.exe df94b4c3f442753fe73840a60821a6c6
v1.1.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.1.1.
This release includes packs that are installed separately from e2 studio. This means the v1.1.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.
The packs, and a standalone pack installer, are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
- USB basic parameter checking could not be properly enabled.
- BLE did not support timeout feature of RM_BLE_ABS_StartScanning().
- It was not documented that USB HHID did not work on the USBHS peripheral of the RA6M3.
- Removed AC6 compiler warning when build r_sci_uart generated code.
- The ELC module instance name in e2 studio is now shown as being fixed in e2 studio.
- The Ethernet PHY target source files were given unique names to resolve an issue with using IAR Embedded Workbench.
- Fixed an issue causing multiple copies of mbedtls/error.h being added to a project which could cause a build error.
MD5 Checksums
- FSP_Packs_v1.1.1.zip b05d78d21c668c6385ba412bf4d411f2
- FSP_Packs_v1.1.1.exe 85818473d0b2dd126cc375b5ff72a613
- fsp_documentation_v1.1.1.zip 2f147523b38ce8c721870f5765fc70e3